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 FDZ391P P-Channel 1.5V PowerTrench(R) WL-CSP MOSFET
September 2008
FDZ391P P-Channel 1.5 V PowerTrench(R) Thin WL-CSP MOSFET
-20 V, -3 A, 85 m Features
Max rDS(on) = 85 m at VGS = -4.5 V, ID = -1 A Max rDS(on) = 123 m at VGS = -2.5 V, ID = -1 A Max rDS(on) = 200 m at VGS = -1.5 V, ID = -1 A Occupies only 1.5 mm2 of PCB area Ultra-thin package: less than 0.4 mm height when mounted to PCB RoHS Compliant
tm
General Description
Designed on Fairchild's advanced 1.5 V PowerTrench process with state of the art "low pitch" Thin WLCSP packaging process, the FDZ391P minimizes both PCB space and rDS(on). This advanced WLCSP MOSFET embodies a breakthrough in packaging technology which enables the device to combine excellent thermal transfer characteristics, ultra-low profile packaging, low gate charge, and low rDS(on).
Applications
Battery management Load switch Battery protection
Pin 1 S S D D S G
S
G
BOTTOM
TOP
D
MOSFET Maximum Ratings TA = 25 C unless otherwise noted
Symbol VDS VGS ID PD TJ, TSTG Parameter Drain to Source Voltage Gate to Source Voltage Drain Current -Continuous -Pulsed Power Dissipation Power Dissipation TA = 25 C TA = 25 C (Note 1a) (Note 1b) TA = 25 C (Note 1a) Ratings -20 8 -3 -15 1.9 0.9 -55 to +150 Units V V A W C
Operating and Storage Junction Temperature Range
Thermal Characteristics
RJA RJA Thermal Resistance, Junction to Ambient Thermal Resistance, Junction to Ambient (Note 1a) (Note 1b) 65 133 C/W
Package Marking and Ordering Information
Device Marking 6 Device FDZ391P Package WL-CSP Thin Reel Size 7 '' Tape Width 8 mm Quantity 5000 units
(c)2008 Fairchild Semiconductor Corporation FDZ391P Rev.B
1
www.fairchildsemi.com
FDZ391P P-Channel 1.5V PowerTrench(R) WL-CSP MOSFET
Electrical Characteristics TJ = 25 C unless otherwise noted
Symbol Parameter Test Conditions Min Typ Max Units
Off Characteristics
BVDSS BVDSS TJ IDSS IGSS Drain to Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate to Source Leakage Current ID = -250 A, VGS = 0 V ID = -250 A, referenced to 25 C VDS = -16 V, VGS = 0 V VGS = 8 V, VDS = 0 V -20 -12 -1 100 V mV/C A nA
On Characteristics
VGS(th) VGS(th) TJ Gate to Source Threshold Voltage Gate to Source Threshold Voltage Temperature Coefficient VGS = VDS, ID = -250 A ID = -250 A, referenced to 25 C VGS = -4.5 V, ID = -1 A rDS(on) Drain to Source On Resistance VGS = -2.5 V, ID = -1 A VGS = -1.5 V, ID = -1 A VGS = -4.5 V, ID = -1 A TJ = 125 C ID(on) gFS On to State Drain Current Forward Transconductance VGS = -4.5 V, VDS = - 5 V VDS = -5 V, ID = -1 A -10 7 -0.4 -0.6 2 74 90 140 100 85 123 200 123 A S m -1.5 V mV/C
Dynamic Characteristics
Ciss Coss Crss Rg Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance VDS = -10 V, VGS = 0 V, f = 1 MHz f = 1 MHz 800 155 90 9 1065 205 135 pF pF pF
Switching Characteristics
td(on) tr td(off) tf Qg Qgs Qgd Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Gate Charge Gate to Source Gate Charge Gate to Drain "Miller" Charge VGS = -4.5 V VDD = -10 V ID = -1 A VDD = -10 V, ID = -1 A VGS = -4.5 V, RGEN = 6 11 10 50 30 9 1 2 20 20 80 48 13 ns ns ns ns nC nC nC
Drain-Source Diode Characteristics
IS VSD trr Qrr Maximum continuous Drain-Source Diode Forward Current Source to Drain Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge VGS = 0 V, IS = -1.1 A (Note 2) -0.7 21 5 -1.1 -1.2 A V ns nC
IF = -1 A, di/dt = 100 A/s
Notes: 1. RJA is determined with the device mounted on a 1 in2 pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. RJC is guaranteed by design while RCA is determined by the user's board design.
a. 65 C/W when mounted on a 1 in2 pad of 2 oz copper.
b. 133 C/W when mounted on a minimum pad of 2 oz copper.
2. Pulse Test: Pulse Width < 300s, Duty cycle < 2.0%.
FDZ391P Rev.B
2
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FDZ391P P-Channel 1.5V PowerTrench(R) WL-CSP MOSFET
Typical Characteristics TJ = 25 C unless otherwise noted
16
NORMALIZED DRAIN TO SOURCE ON-RESISTANCE
2.0 1.8 1.6 1.4 1.2 1.0
VGS = -4.5 V VGS = -3.5 V VGS = -1.5 V PULSE DURATION = 300 s DUTY CYCLE = 2.0% MAX
14
-ID, DRAIN CURRENT (A)
12 10 8 6 4 2 0 0 0.5
PULSE DURATION = 300 s DUTY CYCLE = 2.0% MAX VGS = -4.5 V VGS = -3.5 V VGS = -2.5 V
VGS = -2.0 V
VGS = -2.0 V VGS = -2.5 V
VGS = -1.5 V
0.8 0 2 4 6 8 10 -ID, DRAIN CURRENT(A) 12 14 16
1.0 1.5 2.0 2.5 3.0 3.5 4.0 -VDS, DRAIN TO SOURCE VOLTAGE (V)
Figure 1. On Region Characteristics
Figure 2. Normalized On-Resistance vs Drain Current and Gate Voltage
240
rDS(on), DRAIN TO SOURCE ON-RESISTANCE (m)
NORMALIZED DRAIN TO SOURCE ON-RESISTANCE
1.5 1.4 1.3 1.2 1.1 1.0 0.9 0.8 0.7 -50 -25 0 25 50 75 100 125 TJ, JUNCTION TEMPERATURE (oC) 150
ID = -1 A VGS = -4.5 V
ID = - 0.5 A
PULSE DURATION = 300 s DUTY CYCLE = 2.0% MAX
200 160 120 80
TJ = 25 oC
TJ = 125 oC
40 1
2 3 4 -VGS, GATE TO SOURCE VOLTAGE (V)
5
Figure 3. Normalized On Resistance vs Junction Temperature
IS, REVERSE DRAIN CURRENT (A)
Figure 4. On-Resistance vs Gate to Source Voltage
60
15 12 9 6
TJ = 125 oC
PULSE DURATION = 300 s DUTY CYCLE = 2.0% MAX
10 1
VGS = 0 V
-ID, DRAIN CURRENT (A)
VDD = -5 V
TJ = 125 oC
0.1 0.01 0.001 0.0001
TJ = 25 oC
3 0 0.5
TJ = 25 oC TJ = -55 oC
TJ = -55 oC
1.0 1.5 2.0 -VGS, GATE TO SOURCE VOLTAGE (V)
2.5
0
0.2 0.4 0.6 0.8 1.0 1.2 VSD, BODY DIODE FORWARD VOLTAGE (V)
1.4
Figure 5. Transfer Characteristics
Figure 6. Source to Drain Diode Forward Voltage vs Source Current
FDZ391P Rev.B
3
www.fairchildsemi.com
FDZ391P P-Channel 1.5V PowerTrench(R) WL-CSP MOSFET
Typical Characteristics TJ = 25 C unless otherwise noted
-VGS, GATE TO SOURCE VOLTAGE(V)
5
ID = -1 A
2000
4 3 2 1 0 0 2
1000
CAPACITANCE (pF)
VDD = -5 V VDD = -10 V VDD = -15 V
Ciss
Coss
100
50 0.1
f = 1 MHz VGS = 0 V
Crss
4
6
8
10
12
Qg, GATE CHARGE(nC)
1 10 -VDS, DRAIN TO SOURCE VOLTAGE (V)
20
Figure 7. Gate Charge Characteristics
Figure 8. Capacitance vs Drain to Source Voltage
-IS, SOURCE1 TO SOURCE2 CURRENT (A)
4 -ID, DRAIN CURRENT (A)
30
10
100 us 1 ms
3
VGS = -4.5 V
1
THIS AREA IS LIMITED BY rDS(on)
2
VGS = - 2.5 V
10 ms 100 ms 1s 10 s DC
1
RJA = 65 C/W
o
0.1
SINGLE PULSE TJ = MAX RATED RJA = 133 oC/W TA = 25 C
o
0 25
50
75
100
o
125
150
0.01 0.1
1
10
60
TA, CASE TEMPERATURE ( C)
-VS, SOURCE1 TO SOURCE2 VOLTAGE (V)
Figure 9. Maximum Continuous Drain Current vs Ambient Temperature
50 P(PK), PEAK TRANSIENT POWER (W)
Figure 10. Forward Bias Safe Operating Area
10
VGS = -10 V SINGLE PULSE RJA = 133 oC/W TA = 25 C
o
1
0.5 -3 10
10
-2
10
-1
1 t, PULSE WIDTH (sec)
10
100
1000
Figure 11. Single Pulse Maximum Power Dissipation
FDZ391P Rev.B
4
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FDZ391P P-Channel 1.5V PowerTrench(R) WL-CSP MOSFET
Typical Characteristics TJ = 25 C unless otherwise noted
2
1
NORMALIZED THERMAL IMPEDANCE, ZJA
DUTY CYCLE-DESCENDING ORDER
0.1
D = 0.5 0.2 0.1 0.05 0.02 0.01
PDM
t1 t2 NOTES: DUTY FACTOR: D = t1/t2 PEAK TJ = PDM x ZJA x RJA + TA
-1
SINGLE PULSE RJA = 133 C/W
o
0.01 -3 10
10
-2
10 1 10 t, RECTANGULAR PULSE DURATION (sec)
100
1000
Figure 12. Transient Thermal Response Curve
FDZ391P Rev.B
5
www.fairchildsemi.com
FDZ391P P-Channel 1.5V PowerTrench(R) WL-CSP MOSFET
Dimensional Outline and Pad Layout
FDZ391P Rev.B
6
www.fairchildsemi.com
FDZ391P P-Channel 1.5V PowerTrench(R) WL-CSP MOSFET
TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. Build it NowTM CorePLUSTM CorePOWERTM CROSSVOLTTM CTLTM Current Transfer LogicTM EcoSPARK(R) EfficentMaxTM EZSWITCHTM *
TM
(R)
Fairchild(R) Fairchild Semiconductor(R) FACT Quiet SeriesTM FACT(R) FAST(R) FastvCoreTM FlashWriter(R) * FPSTM
F-PFSTM FRFET(R) Global Power ResourceSM Green FPSTM Green FPSTM e-SeriesTM GTOTM IntelliMAXTM ISOPLANARTM MegaBuckTM MICROCOUPLERTM MicroFETTM MicroPakTM MillerDriveTM MotionMaxTM Motion-SPMTM OPTOLOGIC(R) OPTOPLANAR(R)
(R)
tm
PowerTrench(R) Programmable Active DroopTM QFET(R) QSTM Quiet SeriesTM RapidConfigureTM
The Power Franchise(R)
tm
PDP SPMTM Power-SPMTM
TinyBoostTM TinyBuckTM TinyLogic(R) TINYOPTOTM TM TinyPowerTM Saving our world, 1mW /W /kW at a timeTM TinyPWMTM SmartMaxTM TinyWireTM SMART STARTTM SerDesTM SPM(R) STEALTHTM SuperFETTM UHC(R) SuperSOTTM-3 Ultra FRFETTM SuperSOTTM-6 UniFETTM SuperSOTTM-8 VCXTM SupreMOSTM VisualMaxTM SyncFETTM (R)
* EZSWITCHTM and FlashWriter(R) are trademarks of System General Corporation, used under license by Fairchild Semiconductor. DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD'S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
ANTI-COUNTERFEITING POLICY Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Farichild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com, under Sales Support. Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed application, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Farichild strongly encourages customers to purchase Farichild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild's quality standards for handing and storage and provide access to Farichild's full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address and warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Farichild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative / In Design Definition Datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design. Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only.
Rev. I36
Preliminary
First Production
No Identification Needed Obsolete
Full Production Not In Production
FDZ391P Rev.B
7
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